Snr/Process Engineer (Solder & Nickel Plating)

About the role

Senior/Process Engineer role focused on solder plating and nickel plating process development. The position exists to develop solder plating and nickel plating process capability, establish process stability for high volume manufacturing, and continuously improve wafer processes and capabilities to attain the highest quality and productivity through work simplifications and standardization, implementation of best known methods and controlled operating procedures.

Key responsibilities

• Develop process capability and establish high volume manufacturing process stability of solder and nickel plating process
• Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers' requirements in terms of quantity, yield and cycle time
• Provide interim and long-term corrective actions for any discrepancies
• Liaise with customers and potential customers on development and improvement of process, material and equipment capabilities
• Create new recipe setup for every new device and perform process characterization for bump dimension, bump shear, bump void
• Monitor concentration, lifespan and condition of solder/nickel/Cu bath, plating uniformity, plating quality
• Provide backup support for Cu Plate process for IPD and RDL
• Co-work with solder reflow engineer to establish flux coat and reflow process for plated solder bump
• Manage cost and quality improvement projects

About you

• Degree in Chemistry, Chemical Engineering or equivalent
• 2 years of relevant experience in solder plating, nickel plating, wafer bumping or wafer fabrication preferred
• Knowledge in SPC and JMP