Software Architect

Firmware Architect

Location: Greater Bengaluru Area (Hybrid)/ Greater Hyderabad

https://www.thecube.net/events/nyse/ai-factory-data-center-of-the-future/content/Videos/d1ad8af3-1424-4336-a9b3-1d02b5a354b4

we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.

Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.

our architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.

. Location: Hyderabad/Bangalore

We are actively seeking a Software Architect either based in Hyderabad OR Bangalore.

Responsibilities:

• Architect CMIS 5.x stack (DataPath State Machine, VDM, I2C/MCTP, FW-SW interface)
• Lead host interop tests for hyperscalers (Meta, AWS, etc.), build test matrix and regression suite
• Develop manufacturing test orchestration (ATE integration, yield analytics, on-chip stimulus)
• Build telemetry pipeline from FW to host/cloud (formats, compression, SDK APIs)
• Own customer SDK and tools (C/Python, CLI, log analysis), release management
• Ensure standards compliance (CMIS 5.x, OSFP MSA, SFF-8024, OIF)
• Travel: Up to 25% (customer engagement, manufacturing, standards)

Skills:

• Good knowledge of C/C++, Python, systems language (Go/Rust); CI/CD, conformance tests
• Good knowledge of I2C/MCTP, SFF-8024, vendor extensions
• Good understanding of standards implementation (OIF, SFF, IEEE mgmt-plane)
• Good knowledge of architecture documentation (SHALL/MUST, REQ traceability)
• Self-motivated, with strong sense of ownership and responsibility
• Good communication and reporting skills

Experience:

• Principal / Senior Staff (8-12 years post-degree)
• 8-12 years high-speed interconnect software (module SW, management, test, SDK)
• CMIS 4.x/5.x implementation and OSFP MSA experience
• Hyperscaler interop with NIC/switch ASICs (Nvidia, Broadcom)
• Test software architecture with ATE/yields
• Manufacturing and field support experience

Education:

• BS in Electrical Engineering, Computer Engineering, or Computer Science (MS preferred)

If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!

If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!

Skills

Interconnects

SDK

CMIS

OSFP

MSA

Hyperscaler

NIC

Smartnic

Switch

C

C++

OIF

Datapath

VDM

SFF

Contact

Uday

muday_[email protected]

Mulya Technologies

"Mining the Knowledge Community"