Find a jobRecruiters

Software Engineering - BSP Kernel Professional

Exclusive opportunity

Onsite

Software Engineering - BSP Kernel Professional

HARMAN International

Software Engineering - BSP Kernel Professional

Skills

CybersecurityLinux

5 days ago

Share this opportunity

Share this opportunity to other talents of your network:
✓ Offer them a visibility boost with clients.
✓ Help your contacts find their next job.

Important information


Contract type:

Permanent

Location:

Kalyani, West Bengal, India

Work mode:

Onsite

Published on:

15 October 2026

What they need


Job highlights

  • Bachelors or masters degree in Computer Science,Electronics Engineering,Embedded Systems,or a related technical discipline
  • Experience with Qualcomm Snapdragon Automotive platforms
  • Willingness to travel as required
  • Proficient in Embedded C programming with knowledge of C++,and hands-on experience with Device Tree,bootloader concepts,and ARM-based architectures

Job Summary

You will be involved in kernel development, device driver integration, board bring-up, system debugging, performance optimization, and hardware-software integration activities. You will play a key role in delivering robust, scalable, and production-quality embedded Linux solutions for global automotive customers.

Your Team

You will be part of a highly skilled Linux Platform and BSP engineering team responsible for developing Automotive Infotainment platforms across multiple customer programs. You will collaborate closely with BSP architects, kernel developers, device driver engineers, integration teams, validation teams, hardware teams, and SoC vendors.

What You Will Do

  • Linux Kernel BSP Development: Develop, customize, maintain, and debug Linux Kernel and BSP software for Automotive IVI platforms.

  • Design, develop, integrate, and debug Linux device drivers. Support driver development for subsystems like Display, Audio, USB, Storage, Connectivity modules, Sensors, Vehicle interfaces etc.

  • Work closely with hardware teams to enable and validate new peripherals and platform features.

  • Work with automotive and embedded SoCs including Qualcomm, Samsung Exynos, MediaTek, NXP, Renesas, and TI platforms.

  • Perform root-cause analysis and resolution of Linux Kernel, BSP, and system-level issues, including kernel crashes, panics, memory leaks, driver defects, boot-time/runtime failures, and stability problems by analyzing kernel logs, crash dumps, trace data, and open-source software components.

  • Drive system performance analysis and optimization by identifying and resolving bottlenecks related to CPU utilization, memory consumption, boot time, responsiveness, stability, reliability, and overall platform performance.

    Requirements

  • Bachelor's or master's degree in Computer Science, Electronics Engineering, Embedded Systems, or a related technical discipline.

  • 3-5 years of hands-on experience in Linux Kernel, BSP, and Embedded Software Development, preferably in Automotive IVI or embedded platforms.

  • Strong expertise in Linux Kernel internals, device driver development, BSP customization, board bring-up, hardware-software integration, and Embedded Linux architecture.

  • Proficient in Embedded C programming with knowledge of C++, and hands-on experience with Device Tree, bootloader concepts, and ARM-based architectures.

  • Good understanding of Linux Kernel subsystems, including Memory Management, Interrupt Handling, IPC, Filesystems, and Power Management, along with strong debugging and root-cause analysis skills.

  • Experience with debugging and profiling tools (GDB, ftrace, perf, strace, crash), Git-based development workflows, CI/CD environments, and communication interfaces such as SPI, I2C, UART, and I2S etc.

    Nice to Have

  • Experience with Qualcomm Snapdragon Automotive platforms.

  • Experience with MediaTek, Samsung, NXP, and TI automotive SoCs.

  • Experience in Automotive Infotainment (IVI), Cockpit, or Digital Cockpit platforms.

  • Knowledge of automotive communication protocols and vehicle interfaces.

  • Experience with performance profiling, tracing, and system optimization tools.

  • Exposure to Hypervisor and Multi-OS environments.

  • Familiarity with Automotive Cybersecurity concepts.

  • Familiarity with Functional Safety (FuSa) concepts.

  • Experience working in ASPICE-compliant development environments.

    What Makes You Eligible

  • Ability to lead teams and customer engagements.

  • Willingness to travel as required.

  • Passion for technical excellence and mentoring.

  • Contribute to continuous improvement of HARMAN's architecture design processes.

Disclaimer: This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.

Other offers great for you!

These companies are also looking for great profiles

Rheso.tech

Ingénieur Linux Kernel

45-55k€ (Annuel)

Permanent contract

Toulouse, France

Hybrid

Skills

Sound DesignAnimationVideo & Film

1 year ago

Quick apply

Rheso.tech

Ingénieur Linux Kernel

45-55k€ (Annuel)

Permanent contract

Lyon, France

Hybrid

Skills

Sound DesignAnimationVideo & Film

1 year ago

Quick apply

Vorstone

Forward Deployed Engineer (FDE) – Ingénieur IA / Software Engineering -Paris

600-700€

Freelance

Paris, France

Hybrid

Skills

Data EngineeringRESTful APIsAIsoftware engineeringénieur logicieldéveloppement logicielingénierie logicielleInteligence Artificielleintégration applicativefull-stackIA générativeLLMagents IA

2 days ago

Quick apply

The best place to find your next move

© 2026. All Rights Reserved.

Talents

Find a job

Create a profile

Solutions and tools