Solution Engineer (Thermal & CFD Simulation)

Are you passionate about cutting-edge thermal management and simulation? Do you thrive at the intersection of technical excellence and customer success?

Our client is expanding their footprint across Southeast Asia and globally and they are looking for a technically driven Solution Engineer to join them. This is a newly created role and you will report to the Head of Sales.

About the Client

Headquartered in Singapore, this dynamic engineering software innovator specializes in advanced computer-aided engineering (CAE) and multi-physics simulation solutions. Founded in 2024, the company bridges the distribution of premier industrial tools with the development of next-generation proprietary platforms. Backed by seasoned simulation experts, they deliver cutting-edge thermal management and simulation technologies to accelerate Industry 4.0 globally.

What You’ll Do

• Drive Technical Engagements: Lead pre- and post-sales activities, including deep-dive requirement discovery, impactful product demos and technical presentations.
• Lead POCs & Benchmarking: Own the end-to-end customer proof-of-concept lifecycle - from geometry modeling and advanced meshing to solving and reporting.
• Be the Subject Matter Expert: Provide specialized thermal simulation insights, particularly for semiconductors, electronics packaging and high-tech applications.
• Bridge Sales & R&D: Collaborate closely with internal teams to drive product adoption, share customer feedback and help shape future product features.
• Empower the Ecosystem: Support webinars, seminars, partner enablement and hands-on customer training sessions.

What We’re Looking For

• Education: Bachelor’s, Master’s, or PhD in Mechanical Engineering, Electronics Engineering, or a related technical discipline.
• Experience: At least 3 years of hands-on thermal simulation and CFD/FEA experience (senior roles tailored for advanced degrees/experience).
• Tool Expertise: Strong proficiency and hands-on experience with Flotherm, Icepak, Fluent, or Star-CCM+.
• Bonus Skills: Experience in semiconductor packaging, data center servers, 5G devices, power electronics or HPC/GPU cooling design.
• Soft Skills: Exceptional communication and client-facing abilities, proactive mindset and a readiness to thrive in a fast-paced startup environment with regional travel across Southeast Asia.

What Our Client offer:

• Early-stage, high-ownership role with visibility; shape GTM, product-market fit and the first local team.
• Negotiable compensation commensurate with experience, including performance-based incentives (OTE).
• Tools, budget, and HQ support to execute quickly and scale effectively.

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You may withdraw your consent at any time by notifying us in writing.

EA License Number: 24C2623 | R1110923