Sr. Engineer, NTI/NPI in Back-End Technology (R&D)

You will be the Sr. Engineer, NTI/NPI in Back-End Technology, leading and managing new technology, platform, and product introductions, either pre-development and/or development for Assembly Processes focused on interconnect.

• Technical expertise: Assembly – preferably with knowledge in interconnect (any of the following; having multiple competences in interconnect is a plus): Wirebond (Au/Al/Cu)/Flip Chip/Clip Bond/Ribbon/Sinter/SMT etc.
• Application of project management approach in development such as PCP or APQP or equivalent.
• Responsible for developing new interconnect processes to support new products/packages to create new business opportunities.
• Evaluate, qualify, and introduce new process/methodology though DoE definition, in compliance with the design rules and release procedures to ensure that the product is ready for high volume production.
• Participate in establishing design rules and process roadmaps.
• Develop new tooling and define breakthrough procedures which would improve process development cycle time/efficiency.
• Provide day-to-day package/process support requirements focused on cost reduction and efficiency improvement.
• Coordinate with manufacturing/QA/process engineers and support teams to release new packages/products and transfer projects smoothly.
• Preparing and reviewing Risk Assessment (DFMEA), Design for Manufacturing (DfM) and Control Plan for NTI/NPI releases.

We are looking for someone who has the following background and capabilities:

• Graduate with a Bachelor’s degree in Electronics Engineering, Electrical Engineering, Industrial Engineering, Manufacturing Engineering, or a related field.
• Must have at least five (5) years of relevant experience in project management within electronics manufacturing and semiconductor packaging.
• Strong understanding of RF product assembly processes, SMT, die attach, wire bonding, soldering, testing, and manufacturing operations.
• Knowledge of project management methodologies and tools (PCP).
• Strong leadership, organizational, communication, and problem-solving skills.
• PMP, CAPM, Agile, or other project management certification is a plus.
• Familiarity with Lean Manufacturing, Six Sigma, APQP, PFMEA, SPC, and Process Validation methodologies.

Benefits:

• Additional leave
• Company Christmas gift
• Company events
• Health insurance
• Life insurance
• Opportunities for promotion
• Paid toll fees
• Pay raise
• Promotion to permanent employee
• Staff meals provided
• Transportation service provided

Education:

• Bachelor's (Preferred)

Experience:

• project management within electronics manufacturing: 5 years (Required)
• project management within semiconductor packaging: 5 years (Required)

Work Location: In person