Sr. MTS, Etch RF Engineering

About Mattson

Company: Mattson Technology, Inc., a 38-year Silicon Valley company, designs, manufactures, markets, and globally supports plasma and rapid thermal processing equipment to fabricate integrated circuits for the global semiconductor industry.

Mattson Technology, Inc. offers processing equipment that utilizes innovative technologies to deliver advanced processing capabilities and high productivity for the fabrication of current and next-generation integrated circuits. Our equipment and technologies are used by leading memory and logic, analog /power device manufacturers worldwide. Innovations from Mattson Technology in Atomic Surface Engineering address the most critical logic and memory manufacturing challenges.

In May 2016, Mattson Technology was acquired by Beijing’s E-Town Capital. Our new investor’s vision is that Mattson Technology, with its Silicon Valley DNA, will continue to operate as a global, market-driven technology provider serving worldwide semiconductor manufacturing customers. In July, 2025, the company successfully listed in Shanghai’s STAR Exchange. As the external trade compliance environment evolves, Mattson Technology now operates independently from the parent company in product, business, and operations, serving customers outside of China.

Key Responsibilities:

• Develop and improve RF components/systems for plasma processing equipment.
• Work in cross-functional teams within the BU (mechanical, electrical, systems, process, supply chain,…), along with suppliers, to continuously improve the tool’s process capability, performance, and productivity.
• Characterization and qualification of new RF hardware for incorporation into the plasma processing equipment.
• Data analysis to rapidly provide solutions to customer problems and determine appropriate limits and specifications for tool operation.
• Lead projects and teams from C&F phase through to full release and high-volume manufacturing. Drive implementation of new technology solutions for customers, including potential travel to customer sites.

Requirements:

• Ph.D. or MS with 5+ years relevant experience, or BS with 10+ years relevant experience.
• Detailed knowledge on state of the art plasma etch/strip processing, hardware design, and hands on troubleshooting skills of plasma processing equipment.
• Able to deal with complicated internal or customer problems under deadline pressure in a highly dynamic environment.
• Self-motivated and able to take initiative.
• Strong verbal and written communication skills.
• In-depth knowledge of the interaction between equipment design and process performance.
• Able and willing to travel internationally to support critical customer issues (up to 10%).