Sr. Package Design Engineer

该职位来源于猎聘 Main Responsiblities:

• Mainly focused on new tech/platform pkg development/improvement.
• Interact with PLs and silicon designers in US and overseas on package design.
• Interact with internal assembly site and external OSAT (Out Sourcing Assembly and Testing) partners on package designs and carry out from concept to MP.
• Interact with material suppliers, such as LF,Clip, solder, mold compound and assembly tools for assembly process enhancements.
• An overall R&D project schedule management.
• Play as a team member and actively involve in Pkg R&D related projects. Qualifications:
• Master degree and above, 5-10 years of experiences in power Electronics package design (Si, GaN, SiC, LF based, substrate based).
• Experience in AutoCAD and SolidWorks for package designs.
• Experiences ANSYS for thermal and stress simulation
• Leas Frame design, clip design.
• Experience in R&D concept development and novel power electronics packaging technologies.
• Experience with assembly manufacturing process and environment( soldering, die attach, wire bonding and molding).
• Excellent English and verbal communication skills.