Sr. Packaging Engineer (Semiconductor)

Responsibilities

• Develop new packages and processes to support new product launches on time. (50%)
• Carry out Packaging Design for new products, feasibility studies with Assembly subcons, Risk Assessments and develop Gantt charts for projects. (30%)
• Troubleshoot and Support production related packaging issues. (20%)
• Designing new packages, layout of lead frame and substrate panels.
• Run risk analyses for new product scenarios.
• Debug subcon production issues.
• Make design and process decisions to achieve best in class new product realization.

Minimum Qualifications

• B.Sc. ENG. Preferably Masters with major in Materials Science or Electrical Engineering
• 8 to 10 years of experience working in packaging industry either for assembly subcon or as a designer in New Product Team
• Excellent analytical and trouble shooting skills with the ability to proactively solve issues
• Effective verbal and written communication to interface at all levels within the organization
• Strong sense of urgency to meet product requirements on schedule
• Experience in working with international and cross-functional teams
• AutoCAD package design is required. SolidWorks and Thermal simulations are plus.
• Proficiency in Microsoft Office™ products - Excel, Word, Visio, Power Point, Project