OSI Systems
Sr. Process & Production Engineer
2 months ago
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Important information
Contract type:
Permanent
Location:
Hyderabad, Telangana, India
Work mode:
Onsite
Published on:
18 August 2026
What they need
Responsibilities
- Development of semiconductor / Optoelectronics assembly Packaging like LEDs, Hybrid Micro circuits, Chip on boards, optoelectronics packages
- Process development of die attach , wire bonding , encapsulation etc , on various substrates using eutectic , solder , conductive / non conductive epoxies etc and transition to manufacturing scale ;
- To take lead in Technology /Product transfer from sister companies, NPI Engineering , BOM creation and Maintenance, proto typing FA Approvals
- To workout manufacturing cost estimates , equipment capacity requirements , production ramp up requirements
Sustaining process engineering support , training Manufacturing personnel on developed process , SPC and yield analysis. - Investigate Customer Complaints / corrective action requests , Faiure and route cause analysis and initiate corrective and preventive action measures working with other functional groups
Qualifications
- 10+ years hands on experience in a reputed Semiconductor / Optoelectronics manufacturing plant in assembly and packaging process development of die attach , wire bond and encapsulation .
- Programming skills with automatic epoxy machines, Optical measurement systems desirable.
- Working knowledge of FMEA , Six Sigma and statistical analysis using Minitab etc;
- To interpretate mechanical drawings . Experience preferred to generate drawings in Solid works , Autocad drawings , Programming vision based measurement systems and process equipment.
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Disclaimer: This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.
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