Sr. Process Engineer

We are seeking a highly skilled Manufacture Process Engineer to lead and optimize manufacturing processes for Printed Circuit Board Assemblies (PCBA). This role is critical in ensuring high-quality, reliable, and cost-effective production through expertise in stencil design, soldering processes, wave solder profiling, conformal coating, and secondary operations. The ideal candidate will bring deep technical knowledge, hands-on experience, and a continuous improvement mindset to advance our PCBA manufacturing capabilities.

⚙️ Key Responsibilities

• Process Development & Optimization

• Design, validate, and optimize stencil designs for solder paste application.

• Develop and maintain reflow soldering profiles, including vapor phase reflow processes, to ensure robust solder joints and minimize defects.

• Establish and refine wave soldering profiles for through-hole components.

• Define and implement secondary operations including press-fit connector installation, heat sink attachment, and mechanical assembly steps.

• Develop and oversee conformal coating processes to ensure environmental protection and product reliability.

• Create and enforce rework standards for soldering, ensuring compliance with IPC and industry best practices.

• Manufacturing Support

• Provide technical leadership to production teams in troubleshooting assembly issues.

• Collaborate with design engineering to ensure manufacturability of PCB layouts and component selection.

• Drive yield improvement initiatives and root cause analysis for process-related defects.

• Lead Corrective and Preventive Action (CAPA) initiatives to eliminate recurring issues and strengthen process robustness.

• Support new product introduction (NPI) by developing scalable and repeatable assembly processes.

• Quality & Compliance

• Ensure adherence to IPC-A-610, J-STD-001, IPC-7711/7721, and other relevant industry standards.

• Maintain documentation of process parameters, work instructions, and control plans.

• Partner with quality engineering to implement corrective and preventive actions (CAPA).

• Continuous Improvement

• Lead projects focused on automation, efficiency, and cost reduction.

• Evaluate and introduce new technologies, equipment, and materials to enhance PCBA processes.

• Train and mentor junior engineers and technicians in advanced assembly techniques.

Qualifications & Experience

• Education: Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field. Master’s preferred.

• Experience: Minimum 7–10 years in PCBA manufacturing engineering, with proven expertise in:

• Stencil design and solder paste application.

• Reflow soldering (including vapor phase reflow) and thermal profiling.

• Wave soldering process development and optimization.

• Conformal coating application and process control.

• Secondary operations (press-fit connectors, heat sinks, mechanical assembly).

• Rework and repair standards for solder joints.

• Root cause analysis and CAPA methodologies for troubleshooting and issue resolution.

• Strong knowledge of IPC standards (IPC-A-610, J-STD-001, IPC-7711/7721).

• Hands-on experience with SMT equipment, AOI/X-ray inspection, and process monitoring tools.

• Demonstrated success in NPI process development and scaling to volume production.

• Excellent problem-solving, analytical, and communication skills.

• Ability to lead cross-functional teams and drive process improvements in a fast-paced environment.

Preferred Skills

• Experience with Design for Manufacturability (DFM) and Design for Test (DFT) principles.
• Familiarity with Lean Manufacturing and Six Sigma methodologies.
• Proficiency in CAD tools for stencil and fixture design.
• Knowledge of advanced soldering techniques (selective soldering, laser soldering).
• Strong project management and leadership capabilities.

Benefits

• 401(k)
• 401 (k) matching
• Dental insurance
• Health insurance
• Vision insurance
• Paid time off