Sr Staff Engineer, Physical Verification

We are seeking an experienced Physical Verification (PV) Engineer to drive signoff verification and tapeout readiness for advanced ASIC/SoC designs. The candidate will be responsible for executing and debugging physical verification checks, driving violation closure, maintaining foundry-qualified verification flows, and ensuring block and full-chip layouts meet manufacturing requirements before tapeout.

Key Responsibilities

• Perform and drive signoff Physical Verification for block- and chip-level designs.

• Execute and analyze DRC, LVS, ERC, Antenna, and Density checks using industry-standard signoff tools.

• Debug verification violations and provide actionable recommendations to Physical Design and Layout teams.

• Drive closure of signoff issues through effective tracking, prioritization, and cross-functional collaboration.

• Maintain and support foundry-qualified rule decks, runsets, and waiver management processes.

• Manage waiver tracking and ensure compliance with foundry guidelines and project signoff requirements.

• Coordinate verification re-runs following design changes and ECOs to identify regressions and maintain signoff quality.

• Work closely with Physical Design, Layout, Foundry/PDK, and Program teams to achieve tapeout milestones.

• Generate periodic signoff status reports, metrics, and violation summaries for project reviews.

• Prepare final signoff evidence including DRC/LVS-clean reports, waiver summaries, and residual risk assessments for tapeout reviews. Qualifications

• Bachelors or Masters degree in Electronics Engineering or Electrical Engineering.

• 10-15 years of experience in Physical Verification, Physical Design, or Backend Implementation.

• Strong expertise in DRC, LVS, ERC, Antenna, and Density verification methodologies.

• Hands-on experience with Calibre, Pegasus, or equivalent physical verification tools.

• Good understanding of foundry signoff requirements, PDKs, and semiconductor manufacturing rules.

• Experience in debugging and resolving complex signoff violations at block and full-chip levels.

• Familiarity with GDSII/OASIS databases, netlists, and tapeout processes.

• Proficiency in Tcl, Python, Perl, or Shell scripting.

Preferred Qualifications

• Experience with advanced technology nodes (7nm, 5nm, 3nm, and below).
• Knowledge of Physical Design, PDN, STA, and implementation flows.
• Experience supporting multiple successful SoC tapeouts.
• Strong problem-solving, communication, and stakeholder management skills.

Why Join Us

Join a high-impact team responsible for ensuring silicon manufacturability and signoff quality for next-generation SoCs. You will work closely with design, implementation, and foundry teams to drive successful tapeouts on cutting-edge process technologies.

Disclaimer: This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.