Sr. Wafer/Package Saw Engineer(R&D)

该职位来源于猎聘

• Overall development of platform package technologies & complex derivatives covering POR, material, tooling characterizations, qualifications & release.
• Ensure material TDS, MSDS and the associated tests are carried.
• Ensure tooling dimensional tests are carried out, CTQ defined.
• For new technology eqpt ensure COO & purchase specifciations are defined and deliverables executed.
• Carry out FMDRC, DOE, Validation & qualification. Define Key input/ output variables,
• Define specs and specs limits
• Define and validate special characteristics.
• Define wafer saw/ package saw; trim/form/singulation key input & output variables.
• Execute prototype builds, customer sample builds and qualification builds
• Carry out package design/ process design optimization
• Ensures handshaking with Process Sustaining team and work together to run pre-production builds.
• Package Development Issues problem solving
• Ensures Pkg Development Key Performance indices meet or exceeds goal. 任职要求：
• BA & above degree,major in electronics or materials. 2. 3+ years semiconductor factory NPI experience, having a project management experience is preferred.
• Be very familiar with assembly process, especially for new process/technology.
• Good new product introduction system concept, be familiar with APQP is preferred.
• Good project management skills.
• Strong Communication skill, team work spirit and leadership.
• Good English communication skills.