Staff Engineer - 3D Integration (d/m/f)

Sense the power of light

The ams OSRAM Group is a global leader in innovative light and sensor solutions. With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting-edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries. “Sense the power of light” – our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends.
Find out more about us on https://ams-osram.com

Your new responsibilities

• Develop manufacturing process modules in collaboration with internal and external Fabs, from concept design through implementation
• Take ownership of projects or work packages depending on the project size and complexity and lead sub-teams within larger projects
• Definition, implementation, analysis and documentation of experiments
• Solve problems during process development and take technical decisions within projects
• Collaborate in a team-oriented environment with a strong emphasis on quality, timely project execution and documentation
• Lead the characterization of material/technologies during development and compile comprehensive, data-driven reports
• Apply structured risk assessment techniques (e.g.: FMEA) and mitigate/minimize risks during development to ensure successful project completion and a seamless handover to production
• Propose innovative process and device concepts, contributing to the company’s intellectual property portfolio through patent submissions

Who we are looking for

• Advanced university degree (Master’s or PhD) in Physics, Chemistry, or a related scientific or engineering discipline
• Strong understanding of Through Silicon Vias (TSVs) with a focus on the development, integration and industrialization of process modules
• Experience with Wafer-to-Wafer bonding and Die-to-Wafer stacking as basis for the development of 3D and heterogeneous integration concepts
• Proven team player with excellent collaboration skills
• Proficient in English, both written and spoken, with a clear and structured reporting style

We offer competitive salaries and additional benefits based on your performance, experience and qualification.

The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).
We offer a higher compensation depending on your expertise and skills.

Please contact Stefanie Kleierl for further information via [email protected] or +49 (941) 8501391.