Infineon Technologies (Malaysia) Sdn Bhd
Staff Engineer Maintenance (Wire Bond)
1 month ago
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Important information
Contract type:
Permanent
Location:
Malacca, Malaysia
Work mode:
Onsite
Published on:
14 September 2026
What they need
#WeAreIn for jobs that impact everyone's life
Help us shape the foundation that keeps Infineon’s production running – stable, safe, and ready for the future.
As a Staff Engineer Maintenance in our Manufacturing and Operations team, your contribution ensures that innovation never stands still. Together, we make reliability our strongest asset.
Are you in?
Your role
Key responsibilities in your new role
- Develop and establish comprehensive maintenance strategies to ensure all equipment, including metrology equipment, operates safely with high availability, reliability, and quality performance.
- Lead the Wire Bond and Plasma planned maintenance teams, as well as maintenance technician groups in Assembly, to execute unscheduled maintenance activities in a timely and effective manner.
- Manage Wire Bond and Plasma maintenance costs while sustaining equipment performance at optimal levels.
- Manage the maintenance system, maintenance activities, and maintenance personnel for Wire Bond Assembly and Plasma equipment to achieve maximum equipment efficiency and cost effectiveness.
- Coordinate Wire Bond and Plasma Total Productive Maintenance (TPM) systems and activities within Production, including skill-level training, certification programs, and cross-functional improvement initiatives.
- Coordinate all Safety, Health, and Environment (SHE) activities.
- Establish and enhance equipment setup, conversion, and troubleshooting guidelines to ensure reliable machine uptime.
- Investigate equipment breakdowns and implement effective corrective actions to prevent recurring failures.
- Train and develop the Wire Bond and Plasma technical team by defining competency models and driving technical certification programs.
Your profile
Qualifications and skills to help you succeed
- Bachelor's Degree in Engineering (Mechanical, Electrical, Electronics, Mechatronics, Manufacturing, or related field)
- Minimum 8-10 years of experience in semiconductor manufacturing equipment maintenance, with significant exposure to Wire Bond and Plasma processes
- Proven experience leading maintenance teams, including engineers, technicians, and TPM activities
- Strong knowledge of preventive, predictive, and corrective maintenance methodologies
- Experience managing maintenance budgets, spare parts, and cost control initiatives
- Familiarity with Total Productive Maintenance (TPM), Lean Manufacturing, and Continuous Improvement program
- Strong troubleshooting and root cause analysis skills for equipment failures and reliability issues
- Experience developing technical competency frameworks, training roadmaps, and certification program
- Solid understanding of Safety, Health, and Environment (SHE) requirements within a manufacturing environment
#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.
Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.
Please let your recruiter know if you need any accommodations during the interview process.
Learn more about our various contact channels and about Diversity & Inclusion at Infineon.
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