R
Ram Associates
Staff Package Design Engineer
6 days ago
Share this opportunity
Share this opportunity to other talents of your network:
✓ Offer them a visibility boost with clients.
✓ Help your contacts find their next job.
Important information
Contract type:
Permanent
Location:
Karnataka, India
Work mode:
Onsite
Published on:
18 October 2026
What they need
Qualifications
Minimum Qualifications
- 6+ years of hands‑on experience in package CAD layout and development.
- Strong experience with 2.5D / 3D IC packaging, FCBGA and advanced substrate‑based packages, multi‑die and chiplet‑based designs.
- Proficiency in industry‑standard tools such as: Cadence Allegro Package Designer (APD / SiP), Siemens Xpedition / Innovator 3D IC, or equivalent.
- Experience working with advanced manufacturing design rules and interface with OSATs.
- Good understanding of Signal Integrity (SI) and Power Integrity (PI) fundamentals and High‑Speed Design concepts.
- Strong communication, presentation, and documentation skills with the ability to work effectively in a team environment.
Pay: ₹100,000.00 - ₹300,000.00 per month
Work Location: In person
Other offers great for you!
These companies are also looking for great profiles
E
Espace Freelance
Analytics Engineer / BI Engineer Confirmé
Freelance
Paris, France
Hybrid
Skills
TableaudbtBI EngineeringAnalytics EngineeringSemantic LayerData Modeling
1 day ago
Quick apply
C
Cherrypick
Software Engineer
Freelance
Paris, France
Hybrid
Skills
PythonNumPypandas
21 hours ago
Quick apply
U
Ugitech
IT Strategy & Governance Office Lead (Chief of Staff DSI) H/F
68 000 € Brut
Permanent contract
Marseille, France
Onsite
Skills
Corporate GovernanceChief Strategy Officer
10 hours ago
Quick apply