Staff Process Engineer (Plasma)

Job Descriptions

• Primary owner for plasma etching processes(GaN/SiO2/SiN/ALD film) in ICP chambers .
• Carry out improvement activities related to plasma etching topic (cycle time improvement, CPk improvement, scrap reduction, etag reduction, troughput improvement, cost reduction, new tool start-up and etc).
• Analyze root causes for any process deviations, defects, and yield losses topics related to plasma processes/tools.
• Providing resolution(corrective/preventive action plan) to process issues related to plasma etching.
• Monitor SPC chart and provide improvement plan to ensure Cpk > 1.67
• Maintain and update Standard Operating Procedures (SOPs), process specification, Out of Control Plan(OCAP), FMEA and ECP documents.
• Attend MRB for non-coformance lot disposition and follow up on 8D topic.

Job Requirements

• Candidate must have at least a Bachelor's Degree or above in Engineering.
• Min 3 years of experience in wafer fabrication specialized in dry plasma etching.  Experience in PeCVD is an added advantage.
• Technical knowledge in the area of electronics and/or semiconductor wafer fabrication.
• Knowledge of problem solving skill, 6Sigma DMAIC approach.
• Skilled in SPC/8D/6Sigma/DOE and Literate in statistic software such as JMP/Minitab/Corenerstone.
• Good communication skill in English and Bahasa Malaysia.