Team Leader - Production Process

Core Responsibilities

• Layer Layup & Alignment: Precisely stack inner cores, prepreg, and copper foils using registration pins to ensure perfect alignment.
• Machine Operation: Load and unload heavy steel plates and panels into large industrial bonding presses.
• Parameter Control: Program and monitor precise temperature, pressure, and vacuum profiles to melt and cure the resin without causing warping or air voids.
• Quality Inspection: Inspect bonded panels for defects, delamination, or misregistration using measurement tools and visual checks.

Key Requirements & Skills

• Experience: 1–3 years in electronics manufacturing or printed circuit board fabrication.
• Technical Knowledge: Understanding of PCB stack-ups, material properties, and lamination profiles.
• Dexterity & Detail Orientation: High level of hand-eye coordination and attention to detail for handling fragile copper foils and insulating sheets.
• Physical Stamina: Ability to lift heavy steel press plates and stand for extended periods.