Technical Lead- BSP, Hypervisior, Kernal, Boot Loader

Position: Technical Lead- BSP, Hypervisior, Kernal, Boot Loader (TK712FT RM 4430)

MANDATORY SKILLS : Automotive, Defect Ananlysis, Bug Fixing, BSP, Kernal, HyperV, Boot Loader

Role Overview
This role is for an Automotive BSP Engineer with strong hands-on experience in BSP, Kernel, Hypervisor, and Bootloader development. The candidate should be able to work on low-level platform software, board bring-up, debugging, integration, and issue resolution for automotive embedded systems. Experience in Linux, QNX, or Android-based automotive platforms will be preferred.

Key Responsibilities

• Work on BSP, Kernel, Hypervisor, and Bootloader development activities for automotive platforms.
• Support board bring-up, software flashing, system boot, and platform integration activities.
• Develop, debug, and integrate low-level software components, device drivers, and platform interfaces.
• Analyze and resolve issues related to kernel, bootloader, hypervisor, drivers, and board-level software.
• Work closely with internal teams, customer teams, and system integration teams for technical issue resolution.
• Maintain requirement updates, defect tracking, and technical documentation as per project needs.
• Participate in technical discussions, sprint planning, reviews, and customer calls related to BSP/platform software.

Required Technical Skills

• 7 to 12 years of experience in automotive embedded software development.
• Strong hands-on experience in BSP development and board bring-up.
• Good knowledge of Kernel development, configuration, debugging, and platform integration.
• Experience in Bootloader development, flashing, boot sequence analysis, and boot issue debugging.
• Working knowledge of Hypervisor concepts, integration, and debugging in automotive platforms.
• Experience in low-level device drivers and interfaces such as I2C, SPI, UART, CAN, GPIO, and Ethernet.
• Exposure to Linux, QNX, or Android/AOSP-based automotive platform software.
• Good debugging and root-cause analysis skills for board-level and platform-level issues.
• Automotive domain experience in infotainment, cockpit, telematics, ADAS, or connected vehicle platforms is preferred.
• Experience in requirement tracking, defect management, Agile execution, and technical documentation.

Preferred SoC / Platform Exposure

• Qualcomm Snapdragon Automotive platforms: SA8155P, SA8295P, SA8775P, SA8650P, SA8620P, SA8255P, SA7255P.
• Qualcomm embedded/edge AI platforms: QCS6490, QCS8250, QCS8550, QRB5165.
• Samsung Exynos Auto platforms: Exynos Auto V9, Exynos Auto V7, Exynos Auto T5123.
• Additional relevant SoC exposure: Snapdragon Cockpit, Snapdragon Ride, Qualcomm Automotive Development Platform, Samsung Exynos-based automotive or embedded platforms.

Job Category: Embedded HW_SW

Job Type: Full Time

Job Location: Bangalore Pune

Experience: 7-12 Years

Notice period: 0-30 days

Disclaimer: This job posting and location has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.