Boulder Connect

Role:
Lead Member of Technical Staff, Advanced DRAM Overlay Engineer
Responsibilities
<ul>
<li>Develop and implement overlay solutions for next-generation DRAM technologies</li>
<li>Define overlay specifications, measurement strategies, and process control methodologies</li>
<li>Utilize modeling, experimentation, and data analysis to enhance overlay performance</li>
<li>Collaborate with lithography, metrology, bonding, and manufacturing teams to resolve technical challenges</li>
<li>Engage with suppliers to qualify new overlay capabilities and technologies</li>
</ul>
Qualifications &amp; Skills
<ul>
<li>Bachelor’s degree in engineering, physics, materials science, electrical, or chemical engineering</li>
<li>10+ years in overlay, lithography, metrology, process integration, or related semiconductor fields</li>
<li>Proficiency in data analysis, experimentation, and solving complex technical problems</li>
<li>Understanding of overlay control, process capability, and semiconductor manufacturing fundamentals</li>
<li>Strong communication skills and ability to influence cross-functional teams</li>
</ul>
Preferred Experience
<ul>
<li>Master’s or PhD in relevant fields</li>
<li>Experience with advanced DRAM, wafer bonding, 3D integration, overlay error budgeting, and advanced metrology</li>
<li>Expertise in process control, automation, optimization solutions, and applying AI/analytics in process development</li>
</ul>

Technical Staff Lead - Advanced DRAM Overlay Engineer

Technical Staff Lead - Advanced DRAM Overlay Engineer

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