Technician

1. Die Attach Technician

• Focus: Precision placement of semiconductor dice onto substrates or leadframes using epoxy, solder, or eutectic bonding.
• Key Tasks: Set up and operate die bonders, inspect bond quality, and perform routine tool changes and calibrations.

2. Wire Bond Technician

• Focus: Electrical interconnection of dies using automated wire bonders (ball/wedge bonding).
• Key Tasks: Monitor wire bond loop heights, execute pull/shear tests, optimize bond parameters, and troubleshoot machine errors.

3. Automated Optical Inspection (AOI) Technician

• Focus: Quality inspection of microelectronic assemblies using advanced optical systems.
• Key Tasks: Program and run AOI machines, review defect classifications, and verify component alignment and surface integrity.

4. Test & Quality Technician

• Focus: Functional, electrical, and visual verification of finished semiconductor packages.
• Key Tasks: Run testing scripts/equipment, record production yield data, and flag defects or out-of-control trends.

5. Process Technician

• Focus: Overall line optimization, tool health, and engineering support across packaging modules.
• Key Tasks: Assist process engineers with experiments, troubleshoot recurring line bottlenecks, and drive continuous yield improvements.

Core Qualifications (All Roles)

• Education: High school diploma with technical certification, or Associate degree in Electronics, Mechanical, or a related field.
• Experience: 1–3+ years of experience in a cleanroom, semiconductor back-end, or microelectronics manufacturing environment.
• Skills: Strong mechanical aptitude, high dexterity for handling microscopic components, and familiarity with ESD and cleanroom safety protocols.
• Readiness: Ability to work in a cleanroom environment (bunny suit) and support rotational shifts if required.