Technician - MMIC

JD for Technician

Position: Technician

Experience: 2 TO 5 Years

Required Technical Skills

• Hands-on experience in MMIC/MIC assembly and packaging.

• Good practical knowledge of:

• Die attachment / die bonding

• Wire bonding

• Gold wire and gold ribbon bonding

• Kovar plate attachment

• Alumina PCB/substrate attachment

• MMIC package assembly

• Experience in operating semi-automatic die bonding machines.

• Experience with wire bonding machines and associated tooling/fixtures.

• Ability to understand assembly drawings, dimensional drawings, process specifications, and work instructions.

• Knowledge of microscope-based inspection and basic bond-quality evaluation.

• Familiarity with ESD-controlled environments and clean handling of microwave/MMIC components.

• Knowledge of ISRO PAX standards/requirements and space-grade electronic assembly practices is highly desirable.

Qualification & Experience

• ITI / Diploma / equivalent technical qualification in Electronics, Electrical, Mechanical, or a related discipline.
• 25 years of relevant hands-on experience in MMIC/MIC assembly, semiconductor packaging, RF/microwave assembly, or space-grade electronic assembly.
• Candidates with direct experience in die bonding, wire bonding, Kovar assembly, and Alumina substrate attachment will be preferred.

Preferred Experience

• Experience working on ISRO/space-related projects.
• Experience with ISRO PAX documentation and workmanship requirements.
• Experience in MIC/MMIC packaging and hermetic package assembly.
• Experience with semi-automatic die bonding and wire bonding equipment.
• Familiarity with gold ribbon bonding, thermosonic/thermocompression bonding, and related assembly processes.
• Ability to work in a controlled production environment with high attention to precision and workmanship.