Technology Development Engineer

Responsibilities:

• Drive the design and development of new semiconductor package solutions, including lead frame and laminated substrate packages, based on customer requirements, market trends, and emerging packaging technologies.
• Develop and implement new assembly processes, materials, and process technologies to support new and existing packages.
• Develop and establish design rules, process specifications, and material sets based on assembly process capabilities, manufacturability requirements, and relevant international standards.
• Improve existing assembly processes, equipment, and materials to enhance manufacturability, process robustness, quality, and product performance.
• Lead new technology and package development projects.
• Prepare evaluation plans and matrices, source evaluation materials, and coordinate with assembly teams to conduct engineering evaluations and process trials.
• Collaborate with customers and external vendors to develop suitable designs for process and material improvement.

Requirements:

• Degree in Engineering or Science discipline.

• Knowledge in semiconductor assembly processes & packaging will be added advantage.

• Understanding in engineering drawing, e.g. CAD etc.

• Knowledge in DOE is beneficial.

• Independent and self-motivated with good communication and interpersonal skills.

• Able to work with all levels of employees and customers.

• Mandarin speaking and writing proficiency will be added advantage to liaise with respective customers.

• To be based in Simpang Pulai or Gopeng, Perak.