深圳云英谷科技有限公司
高速TIA芯片设计工程师
3 months ago
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Important information
Contract type:
Permanent
Location:
Shanghai, China
Work mode:
Onsite
Published on:
7 August 2026
What they need
该职位来源于猎聘 岗位职责： 1. 负责面向CPO应用的高速TIA（跨阻放大器）芯片架构定义与电路设计。 2. 主导TIA与硅光探测器（PD）的协同设计与仿真，优化光电链路的带宽、噪声及线性度指标。 3. 带领团队攻克先进工艺节点（如28nm/22nm/14nm CMOS或SiGe）下的低功耗模拟电路设计难题，实现芯片成功流片与量产。 三、任职要求： 1. 硕士及以上学历，微电子相关专业，8年左右或以上高速模拟IC设计经验，5年左右或以上TIA专项设计经验。 2. 精通CMOS/SiGe工艺，有56G/112G及以上速率TIA成功流片及量产经验。 3. 具备深厚的半导体器件物理功底，能够主导解决芯片在系统级应用中的复杂失效问题。
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