VCSEL Chip Packaging Engineer

About the role

VCSEL Chip Packaging Engineer role based at Hong Kong Science Park. The position involves leading wafer testing, dicing, die sorting, die bonding, wire bonding, and dispensing processes, as well as operating and troubleshooting packaging equipment to support high-performance VCSEL and photonic solutions.

Key responsibilities

• Lead wafer testing, dicing, die sorting, die bonding, wire bonding, and dispensing processes
• Operate and troubleshoot packaging equipment (LIV probe stations, dicers, bonders) per SOPs
• Develop and optimize packaging processes to improve yield and quality
• Design package mechanical layouts and maintain technical documentation
• Collaborate on process development and new product introduction
• Deliver production task on schedule
• Other ad hoc tasks as required

About you

• Bachelor's degree in Electrical, Optical, Mechanical Engineering, or related field
• Strong semiconductor and laser diode knowledge; VCSEL experience preferred
• Hands-on experience in packaging process development and troubleshooting
• Familiar with GaAs wafers and substrates (AlN, Al₂O₃, CuAg, Cu)
• Proficient with MPI stations, Disco dicer, ASM/K&S equipment, and AutoCAD/SolidWorks
• High-power LED or power device packaging experience is an advantage
• Good communication and presentation skills
• Good collaborative capability
• Good document-writing skills
• Fluent English, mandarin, Cantonese

About us

Brightlaser drives AI evolution by unparalleled VCSELs and photonic solutions in computing, communications, and sensing. Brightlaser provides high-performance VCSELs, modules, and integrated solutions for Consumable, automotive, Industrial, and Medical applications. Brightlaser serves nearly 2,000 customers worldwide, with a strong presence across the US, EU, UK, Japan, South Korea, Israel, the Middle East, China, and Australia.