Wafer Bonding Process Development Senior Staff Engineer

Description

• Develop (or transfer from Regensburg) Bonding processes to support the Product (Chip) Development projects. Manage own process projects independently and work on project closure as per timeline planned effectively, well-designed experiments and write clear, concise technical reports documenting the results.
• Key task is the development of new tool/ processes, material development from tool selection via process otimization to production release of new processes. Strong understanding of the interactions between process and hardwareis required. Cost optimization projects by process improvement, material saving are part of the function as well. Work closely with Process and Production department on improvement activities and drive for further improvements.
• Deep involvement on new product introduction to ensure smooth transition & ramp up of new products.
• Key interface between Process RnD Regensburg for new processes and technologies, be the expert for Bonding technologies, have a detailled market overview. Work on Collaboration and Standardization.

Requirements

• Degree, Master's, or PhD in Physics, Optics, Electrical Engineering, Materials Science, or a related field.
• Minimum 5 years of experience in the semiconductor industry.
• Experience in wafer bonding and/or metallization processes is an added advantage.
• Good understanding of wafer fabrication processes, semiconductor materials, and bonding technologies.
• Knowledge of relevant analytical and characterization methods.
• Strong communication, presentation, and teamwork skills.Analytical, creative, and able to work effectively in a fast-paced environment.
• Able to independently drive process development, new process introduction (NPI), and R&D activities.