Wafer Fab Process Engineer

Job Summary Lead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets.

Key Responsibilities

• Own and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation).
• Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.
• Drive new process integration (NPI) and process transfer to high-volume manufacturing.
• Perform root cause analysis and implement robust corrective/preventive actions.
• Define process control plans, SPC strategies, and OCAP execution.
• Collaborate cross-functionally with equipment, integration, quality, and R&D teams.
• Mentor junior engineers and technicians.
• Interface with suppliers on process and material improvements.

Qualifications

• Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related).
• At least 5 years of semiconductor wafer fab process experience in thin film (metal/passivation) or thermal (oxidation, diffusion, implantation).
• Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.
• Demonstrated leadership in cross-functional technical projects.
• Strong analytical, problem-solving, and communication skills

Preferred

• PhD in Engineering (Electrical, Chemical, Materials, or related).
• Six Sigma certification (Green/Black Belt).
• Experience supporting 4" to 6" wafer scaling or equivalent manufacturing transition.

R026529