Wafer Sawing Engineer

Key Responsibilities:

1) Equipment Operations & Troubleshooting

• Supervise and guide a team of Technicians on Engineering activities
• Oversee CSMO wafer saw quality and issues
• Troubleshoot technical issues through 4M analysis
• Conduct root cause analysis and implement corrective actions to resolve recurring equipment failures

2) Process & Technical Support

• Establish critical process parameters for new devices or new customers
• Drive continuous improvements, e.g. through Automation and SOP enhancement
• Attend customer meetings and audits
• Minimize customer complaints, both internal and external (VOC, VOP), and manage MRB

3) Compliance & Continuous Improvement

• Ensure quality accountability and compliance to spec with continuous enhancement
• Involvement in 5S initiatives
• Perform any other duties as assigned by immediate superior

Requirements:

• Degree in Mechanical, Electrical, Electronic, Mechatronics, or related Engineering discipline (any engineering background accepted with relevant experience)

• Minimum 3–5 years' experience in semiconductor manufacturing, particularly in wafer sawing/dicing processes

• Hands-on experience with DISCO wafer saw machines is preferred

• Familiar with Design of Experiments (DOE) methodologies and automation/equipment troubleshooting

• Exposure to IoT-based monitoring and predictive maintenance solutions is a plus

• Strong understanding of cleanroom protocols and wafer contamination control

• Proven ability in failure analysis and root cause investigation to resolve equipment issues

• Good understanding of quality compliance, 4M analysis, and customer audit requirements (VOC/VOP)

• Strong problem-solving, communication, and time management skills

• Hands-on, proactive, and able to work both independently and in a team