Carsem (M) Sdn. Bhd
Wire Bond Engineer (Open for Senior Wire Bond Technicians)
11 days ago
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Important information
Contract type:
Permanent
Location:
Ipoh, Perak, Malaysia
Work mode:
Onsite
Published on:
15 October 2026
What they need
We are looking for a Wire Bond Engineer to join our team in Ipoh. This role is open to experienced senior technicians who want to step up into an engineering position. You will play a critical role in developing and sustaining wire bond processes for our semiconductor assembly operations, focusing on quality, efficiency and innovation.
Qualifications and Experience (either of the following)
- Diploma / Advanced Diploma in Electrical & Electronic, Mechanical, Mechatronics or Electromechanical Engineering, with 8–10 years of hands-on semiconductor assembly experience, including wire bond equipment (K&S or ASM bonders preferred).
- OR Bachelor’s Degree in Electrical/Electronic, Mechanical, Mechatronics, Materials or a related engineering field. Fresh graduates are welcome to apply.
Key Responsibilities
- Train, motivate and supervise a team of process technicians and engineering operators to achieve wire bond process yield, quality and productivity targets through effective teamwork.
- Provide technical support and solutions to wire bond process and equipment issues, including setup, conversion and troubleshooting of wire bonders (e.g. K&S, ASM).
- Develop and monitor yield, quality and productivity improvement and cost reduction programmes, including engineering and qualification (E/Q) lots.
- Optimise bonding parameters (force, ultrasonic power, time, temperature) and monitor bond quality through wire pull, ball shear and loop profile checks.
- Monitor capillary / wedge tool life and define replacement criteria.
- Develop new processes and source materials and equipment for continuous breakthrough improvement.
- Review and ensure customer specifications are complied with.
- Develop and improve process flow, and update specifications to reflect changes from customers or in-house products.
- Determine standard UPH, standard operating procedures and materials for new equipment and processes.
- Drive quality accountability such as VOC/VOP/MRB/CAPA improvement, and update specifications to reflect controls and customer audit findings.
Added advantage: knowledge of SPC, DOE, FMEA, 8D, or aluminium wire / wedge bonding.
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