Wire Bond Process Development Engineer

About the role

We are seeking an experienced and highly motivated Senior Wire Bond Process Development Engineer to join our global Assembly Process Innovation team. The successful candidate will be responsible for developing, optimizing, qualifying and releasing advanced wire bond processes for semiconductor packages. This role requires strong expertise in copper wire ball bonding, process characterization, statistical engineering methodologies, automotive quality requirements and technology innovation.

The engineer will lead wire bond process development projects, support qualification of new packages and technology roadmap execution, collaborate with global assembly sites, and drive improvements in process capability, quality, reliability and manufacturing readiness. The candidate is also expected to contribute to invention disclosures, patent generation and the adoption of AI-enabled engineering methodologies.

Key responsibilities

• Lead development, optimization, qualification and release of wire bond processes for new semiconductor products, package platforms and wafer technologies
• Establish robust process windows through Design of Experiments (DOE), statistical analysis and process characterization
• Develop and optimize first bond, second bond and looping processes for advanced packaging applications
• Characterize and qualify new wafer technologies, bond pad structures, substrates, leadframes and assembly materials
• Define process specifications, process limits and manufacturing control strategies
• Evaluate and introduce new wire bonding technologies, materials and equipment capabilities
• Lead individual wire bond process development projects from concept through qualification and production release
• Define project objectives, technical deliverables, timelines, risks and mitigation plans
• Coordinate activities with global cross-functional teams from product, assembly and test
• Apply Six Sigma methodologies to process development and optimization activities

About you

• Bachelor's Degree in Mechanical Engineering, Materials Engineering, Manufacturing Engineering, Electronics Engineering, Electrical Engineering, Semiconductor Engineering or related disciplines
• Minimum 5 years of semiconductor assembly experience with direct responsibility for wire bond process development
• Proven hands-on experience with K&S wire bonding platforms
• Strong experience in copper wire ball bonding process development
• Demonstrated experience leading development projects from initiation through production release
• Strong knowledge of Design of Experiments (DOE), Six Sigma methodologies, Statistical Process Control (SPC), Process Capability Analysis, APQP, DFMEA, PFMEA, Control Plans, Risk Management, Root Cause Analysis and Structured Problem Solving
• Experience utilizing JMP or equivalent statistical software tools
• Excellent analytical, technical communication and project leadership skills
• Ability to work effectively within global cross-functional teams