O
OSRAM Opto Semiconductors (Malaysia) Sdn Bhd
Wire Bond Process Development Senior Engineer
1 month ago
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Important information
Contract type:
Permanent
Location:
George Town, Penang, Malaysia
Work mode:
Onsite
Published on:
18 September 2026
What they need
Key responsibilities
- Develop Wire Bond process for mass production to handshake with operation team per project targeted timeline
- Support and contribute in Wire Bond technology building block / roadmap
- Support new product pre-series and ramp-up
- Support post Q5 product quality, yield and FAR topics
Requirements
- Bachelor or Master degree in engineering or relevant field
- 2 - 5 years in semiconductor DA & WB process engineering field
- DA & WB process engineering knowledge & hands on skillset in semiconductors or LED manufacturing processes
- Knowledge in process development step and statistic
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