Wire Bond Process Engineer

The ams OSRAM Group is a global leader in innovative light and sensor solutions. As a specialist in Digital Photonics, we combine technological excellence with state-of-the-art global manufacturing capabilities to offer our customers the broadest portfolio of digital emitter and sensor technologies. Globally, our teams develop groundbreaking solutions aligned with societal megatrends like intelligent mobility, artificial intelligence, augmented reality, smart health, and robotics.

At ams OSRAM, employees are part of a highly innovative, international technology environment. Diverse teams, a high degree of ownership, and exciting challenges provide the opportunity to grow, develop, and make a real difference. Because behind our innovations are people who carry something special inside and who bring their unique strengths to work every day.

Show the world what you are made of.

Your new responsibilities

• Responsible for line sustaining issues & full accountability of outgoing yield and quality of Wire Bond process. KPIV, KPOV & LoD are key. Updating documentation on a timely manner (FMEA, WI, POCAP, CP, Build sheet…etc).
• Hands on & run the equipment/process in production mode. Expected to spend time on the production floor daily.
• Equip with wire bond process knowledge through self-learning and able to do some minor troubleshooting whenever there are any quality/maverick issues occur.
• Work closely with cross functional team like equipment, PO & Quality team on any issues arise.
• Work closely with R&D for new product development to ensure robust process & manufacturability. Support new product pre-series and ramp-up.
• Initiate cost & yield improvement projects which may need to drive the upstream process on any incoming quality deviations.

What we look for

• Min Bachelor's Degree in Electrical / Electronics / Mechanical Engineering or equivalent.
• Preferred with min 8 years working experience in High Volume Manufacturing and Complex process for IC or LED manufacturing.
• Experience in the Wire Bond process is highly preferred.
• 6 Sigma Methodology, Green/Black Belt is an advantage.
• Process control knowledge-Control Plan, FMEA, SPC, MSA, 8D, DOE, Minitab, PBI.

Please contact Nurul Ain Rosli for further information via [email protected] or +60 (4) 3053200.