Wire Bond Process Engineer | Semiconductor Assembly

Main Job Responsibilities

1. Process Yield & Performance

• Monitor and analyze bonding yield, identifying root causes of defects and yield loss.
• Lead yield improvement activities using structured problem-solving methodologies (e.g., 8D, FMEA, DOE).
• Establish and maintain key process control parameters and ensure compliance in production.
• Drive continuous yield improvement to meet internal targets and customer expectations.

2. Process Robustness & Improvement

• Develop and optimize bonding recipes (force, ultrasonic power, time, temperature, etc.).
• Improve process stability and robustness against material and environmental variations.
• Conduct Design of Experiments (DOE) to validate process changes and improvements.
• Implement process standardization and best practices across production lines.

3. Tooling & Equipment Management

• Study and monitor bonding tool (capillary/wedge) life performance and wear-out mechanisms.
• Define tool life criteria, replacement frequency, and optimization strategies.
• Collaborate with equipment and maintenance teams to ensure machine performance and uptime.
• Support equipment troubleshooting and qualification.

4. Customer Support & Technical Interface

• Respond to customer inquiries, complaints, and technical requests in a timely manner.
• Perform failure analysis and provide clear, data-supported reports to customers.
• Participate in customer audits, technical reviews, and meetings as required.
• Ensure alignment of process capability with customer specifications and requirements.

5. Documentation & Reporting

• Maintain accurate process documentation, work instructions, and specifications.
• Prepare technical reports, yield analysis, and improvement updates.
• Ensure compliance with quality management systems and industry standards.

6. Cross-Functional Collaboration

• Work closely with Quality, Production, Maintenance, and Engineering teams.
• Provide technical training and guidance to operators and technicians.
• Lead or participate in continuous improvement and cost-reduction initiatives. Ensure 5s implementation and enforcement.

TECHNICAL SKILLS & COMPETENCIES

• Bachelor’s degree in Engineering (Electrical, Mechanical, Materials, or related field).
• Experience in semiconductor assembly, specifically wedge bonding or wire bonding processes.
• Strong knowledge of statistical analysis and problem-solving tools (SPC, DOE, FMEA).
• Familiarity with bonding equipment and materials (Al wire, substrates, etc.).
• Good communication skills for customer interaction and reporting.