Wire Bond Process Sustaining Senior Engineer

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.

About The Role As a Senior Engineer Wire Bond Process Sustaining, you will be responsible for sustaining and optimizing manufacturing processes for SOT363 package production. You will work closely with Production, Quality, Equipment, and Product Engineering teams to ensure stable processes, high yield, and consistent product quality while driving continuous improvement initiatives.

What You Will Do

• Sustain and monitor SOT363 manufacturing processes to ensure stable production performance.
• Investigate process deviations, yield losses, and quality issues, and implement effective corrective actions.
• Drive continuous improvement initiatives to enhance yield, quality, productivity, and cost efficiency.
• Analyze process data and identify opportunities for process optimization and robustness improvement.
• Conduct root cause analysis and implement preventive measures to eliminate recurring issues.
• Support process qualifications, validations, and engineering evaluations.
• Collaborate with cross-functional teams to resolve process-related challenges and improve manufacturing performance.
• Develop and maintain process documentation, work instructions, and technical reports.
• Support new product introduction (NPI), product transfer, and change management activities as required.

What You Will Need

Qualifications

• Bachelor's Degree in Electronics, Electrical, Chemical, Materials, Manufacturing, Mechanical Engineering, or a related discipline.
• Minimum 5 years of experience in semiconductor process engineering or manufacturing engineering.
• Experience in semiconductor assembly processes within a high-volume manufacturing environment.

Must Have

• Experience in process sustaining, troubleshooting, and yield improvement.
• Strong knowledge of semiconductor assembly processes and process control methodologies.
• Experience with root cause analysis and problem-solving tools such as 8D, FMEA, and CAPA.
• Proficiency in SPC, DOE, and data analysis techniques.
• Strong analytical skills with the ability to drive process improvements through data-driven decision making.

Good to Have

• Experience with SOT363 or similar discrete package technologies.
• Lean Six Sigma Green Belt or Black Belt certification.
• Experience using JMP, Minitab, or equivalent statistical analysis tools.
• Knowledge of reliability testing, failure analysis, and process qualification methodologies.
• Experience supporting NPI, technology transfer, or product ramp-up activities

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark. D&I Statement As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.