Wire Bond (WB) Engineer/Senior Engineer

About the role

Seeking an experienced Wire Bond (WB) Engineer/Senior Engineer responsible to support the new product introduction (NPI) team. This role is located at Melaka site.

Key responsibilities

• Familiar with the material characteristics of copper wire and aluminum wire used in power device assembly, with the ability to develop Wire Bond and Wedge Bond packaging processes.
• Proficient in operating, setting up, and troubleshooting KNS 7200, PowerFusion series aluminum wire bonders, KNS ICONN, and other advanced wire bonding equipment.
• Responsible for new product introduction (NPI), including machine setup, program creation, and process parameter optimization.
• Develop and maintain production operating procedures and work instructions.
• Handle process-related product abnormalities, implement corrective and preventive actions, update quality/process SOPs, and prepare 8D reports.
• Drive process yield improvement and resolve manufacturing process issues.
• Propose and implement cost reduction initiatives related to equipment, materials, and manufacturing processes.
• Support Construction Engineering and Inspection (CEI) in conducting risk assessments for new products and participate in technical discussions with customers when required to optimize product design during the early development stage.
• Update and maintain Control Plan (CP), Failure Mode and Effects Analysis (FMEA), and other related process documentation.
• Standardize and continuously improve Ball Bond and Wedge Bond Design Rules.

About you

• Diploma or above in a relevant field.
• At least minimum 3 years of relevant working experience.
• Able to communicate effectively in English.
• Strong project management skills.
• Excellent customer communication and coordination skills.
• Proficient in Integrated Circuit (IC) semiconductor reliability engineering and advanced failure analysis techniques.
• Proficient in DFMEA, PFMEA, Design of Experiments (DOE), and Control Plan (CP) methodologies.

About us

Our client is a worldwide well-known provider of Semiconductor assembly and test services, offering a full range of turnkey services that include package design, front-end engineering test, wafer test, package assembly and final test. Our client's manufacturing plant is the first Semiconductor facility setup in Malaysia and the first manufacturing plant overseas. It has pioneering packaging and test solutions, positioning it strongly to capitalize on its strong capabilities in Semiconductor assembly and test services.