Wirebond Process Engineer

An established global semiconductor manufacturer is seeking an experienced Assembly Wirebond Process Engineer to support and optimise wirebond manufacturing processes within a high-volume production environment. The role will focus on process development, yield improvement, troubleshooting, new product support, and continuous improvement initiatives to achieve operational excellence.

Client Details

Our client is a multinational semiconductor company with a strong global presence and a reputation for engineering innovation, manufacturing excellence, and technology leadership. Serving customers across numerous industries, the organisation continues to invest heavily in advanced manufacturing capabilities, employee development, and continuous improvement initiatives.

Description

• Support daily manufacturing operations and ensure stable wirebond process performance.
• Develop, qualify, and optimise wirebond processes to improve yield, productivity, quality, and reliability.
• Create and maintain automated wirebond programmes and optimise wedge bonding process parameters.
• Perform process characterisation, experimentation, validation, and capability studies.
• Analyse manufacturing and equipment performance data to identify improvement opportunities and implement corrective actions.
• Lead root cause investigations for process-related issues, quality excursions, and yield losses.
• Establish and maintain statistical process control methodologies and monitoring strategies.
• Develop and maintain technical documentation, process specifications, and work instructions.
• Support equipment qualification, process start-ups, transfers, and production ramp activities.
• Drive continuous improvement projects focused on cost reduction, operational efficiency, and process optimisation.
• Collaborate closely with production, quality, equipment engineering, and cross-functional teams to achieve business objectives.
• Support new product introductions and ensure successful transition into production.

Profile

• Bachelor's Degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related discipline.
• Minimum 5 years of experience in semiconductor wirebond process engineering.
• Hands-on experience with KNS and/or ASM wirebond equipment and processes.
• Strong understanding of wirebond process optimisation, process qualification, and manufacturing controls.
• Knowledge of Statistical Process Control (SPC), engineering change management, and process release methodologies.
• Proven experience in yield improvement, quality enhancement, process troubleshooting, and root cause analysis.
• Strong analytical, problem-solving, and data interpretation skills.
• Excellent communication and stakeholder management capabilities.
• Self-motivated, results-oriented, and able to thrive in a fast-paced manufacturing environment.

Job Offer

• Opportunity to join a leading global semiconductor manufacturer.
• Exposure to advanced semiconductor assembly and packaging technologies.
• High-impact role with strong ownership and visibility across manufacturing operations.
• Collaborative environment that values innovation and continuous improvement.
• Opportunities to work on challenging engineering projects and new technology deployments.
• Professional development and career growth within a global organisation.
• Competitive remuneration and benefits package.

To apply online please click the 'Apply' button below. For a confidential discussion about this role please contact Isabelle De Costa +60323024075.
Agensi Pekerjaan Michael Page International (Malaysia) Sdn Bhd | Registration No.914741-W.