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NAND Collateral DTCO Engineer

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Onsite

NAND Collateral DTCO Engineer

新安传媒有限公司

NAND Collateral DTCO Engineer

3 months ago

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Important information


Contract type:

Permanent

Location:

Dalian, Liaoning, China

Work mode:

Onsite

Published on:

8 August 2026

What they need


该职位来源于猎聘 This position is for: Regular ⠀ ⠀ Job Details: Job Desc ription: This job requisition looks for candidates for the positions of Collateral

Litho DTCO Engineer(Design Technology Co-Optimization), with work location in

Dalian, China, reporting to Collateral Litho Manager. The selected candidates will be responsible for activities covering process driven patterning DFM rule development; drive manufacturability through design, mask and process co-optimization; develop DTCO/STCO solutions with coordinating among EDA, Design, Collateral, Process Integration, Fab process and Assembly teams. Candidates must have demonstrated a track record of excellence in creative problem solving, process and integration capability enabling, enhancement or design for manufacturability optimization in a relevant engineering organization. Responsibilities include: --Perform feasibility study and provide integrated process/design/metrology solutions to meet desired device and process specification as well as MTS requirements. --Define, select and qualify patterning process and design scheme/methodology for DFM structure and/or software platforms to meet technology, quality, output and cost needs of new processes. --Lead new process/design experimentation, implementation and high volume manufacturing readiness. ⠀ ⠀ Qualifications: Technical Qualifications -- MS, or PhD in a science or engineering field and minimum 3 years of experience in semiconductor research, development or manufacturing environment are required. --Demonstrated technical leadership and a track record of problem solving with creativity and out-of-box thinking; --Direct experiences in technology development, transfer or startup are required, a leader role experience is preferred; --Strong expertise of semiconductor device and fab process flow, process/design qualification and troubleshooting is required; --Direct hands-on experience on one or multiple of relevant areas is highly desired such as Process integration/Device, PDK, DTCO/PPA, Litho process,

OPC/Mask/Tapeout, TCAD, Metrology, Fab process(Etch, Thinfilm, Implant and CMP etc.). --Familiar with standard EDA tools(Cadence Virtuoso, Mentor Calibre, Synopsys

S-Litho, etc), scripting capability is a plus. Other Qualifications --Motivated self-starter, with strong ability to work independently as well as in a team environment; --Strong verbal and written communication skills in English; --Think and operate independently, while simultaneously focusing on many diverse priorities; --Flexibility and maturity in facing uncertainties and changing priorities/responsibilities; --Commit to aggressive goals and win with a can-do attitude; --Act with velocity and a strong sense of urgency; --Respect cultural diversity and sensitivity; --Agility in learning, improving, and innovating. ⠀ ⠀ Primary Location: Dalian ⠀ ⠀ Additional Location(s): ⠀ ⠀ Posting Statement: All qualified applicants will recieve consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientatioin, or any other characteristic protected by local law, regulation, or ordinance. ⠀ ⠀ Work Model for this Role: This role will require an on-site presence. ⠀ ⠀ Relocation: Relocation and/or the ability to work from a different location within the country/countries posted may be available based on business need and necessary approvals. ⠀ ⠀

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