Soc Thermal Engineer

Company: Qualcomm India Private Limited

Job Area: Engineering Group, Hardware Engineering

General Summary

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.

Minimum Qualifications

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
• Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
• PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.

Job Title: SoC Thermal Engineer

• SOC Thermal analysis methodology development: encompassing SoC, package and systems, for various Qualcomm products going into smartphones, laptops, automotives and virtual reality headsets.
• Developing strategies to predict and improve thermally constrained scores (AnTuTu/Geekbench) and also measure/tune it on post-Si platforms, including infrared imaging.
• Thermal measurement: The candidate will be responsible for improving thermal mitigation strategies through power and thermal management to achieve optimal system thermal performance.

Skills

• Should possess strong analytical skills and mathematical modeling abilities.
• Provide thermal analysis throughout the SoC product development cycle to identify and mitigate thermal risks, including post-silicon validation and customer collaboration.
• Perform SoC-level thermal analysis to support architecture, product specifications, and Power-Performance-Area-Thermal optimization. Recommend thermal mitigation strategies.
• Develop advanced thermal methodologies, software tools, and scalable processes; collaborate with cross-functional teams to drive efficiency and achieve goals.
• Knowledge of SoC stackup is a must.
• Good knowledge of scripting in PERL/Python required; some exposure to Machine Learning algorithms/frameworks will be a plus.
• Need to have thorough knowledge of heat transfer mechanisms and CFD.
• Proficiency with state-of-the-art thermal analysis tools Ansys Icepak/Flotherm.
• Thermal Measurement will be a preferred skill.