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Wire Bond Process Development Senior Engineer

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Onsite

Wire Bond Process Development Senior Engineer

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd

Wire Bond Process Development Senior Engineer

1 month ago

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Important information


Contract type:

Permanent

Location:

George Town, Penang, Malaysia

Work mode:

Onsite

Published on:

18 September 2026

What they need


Key responsibilities

  • Develop Wire Bond process for mass production to handshake with operation team per project targeted timeline
  • Support and contribute in Wire Bond technology building block / roadmap
  • Support new product pre-series and ramp-up
  • Support post Q5 product quality, yield and FAR topics

Requirements

  • Bachelor or Master degree in engineering or relevant field
  • 2 - 5 years in semiconductor DA & WB process engineering field
  • DA & WB process engineering knowledge & hands on skillset in semiconductors or LED manufacturing processes
  • Knowledge in process development step and statistic

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