星宸科技股份有限公司
【2027校招】硬件系统工程师-厦门
2 months ago
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Important information
Contract type:
Permanent
Location:
Xiamen, Fujian, China
Work mode:
Onsite
Published on:
22 August 2026
What they need
该职位来源于猎聘 1.负责芯片设计可行性分析与前端设计及芯片后期验证工作; 2.负责硬件系统开发与电路设计,建立SOC/FPGA验证系统及公板平台; 3.负责编写硬件平台技术文档; 4.负责硬件系统接口/产品功能分析与高速信号量测 (e.g. DDR3/4, SATA, PCIE, USB3, MIPI etc.. )。 任职资格: 1.本科及以上学历,电子、计算机、自动化等相关专业; 2.掌握基本硬件电路设计与调试,熟悉基于单片机、ARM、FPGA等器件的电路设计和调试,可以运用硬件开发相关工具及PCB设计软件; 3.英语4级以上,读写能力强; 4.有较强的组织协调能力,良好的团队合作精神及沟通能力; 5.爱岗敬业,积极主动,吃苦耐劳,性格沉稳,细心,多做一步,深度思考。 薪资仅供参考,具体以面议为主。
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