星宸科技股份有限公司
【2027校招】封装设计工程师-厦门
2 months ago
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Important information
Contract type:
Permanent
Location:
Xiamen, Fujian, China
Work mode:
Onsite
Published on:
22 August 2026
What they need
该职位来源于猎聘 1.先进封装评估与设计 (Flip Chip, 2.5D封装, 3D封装...)； 2.封装 Thermal 评估与改良； 3.封装设计 (QFN, QFP, BGA, Flip Chip)。 任职资格： 1.大学本科以上，工程相关科系毕业； 2.熟悉auto-cad/allegro操作； 3.学校阶段具新封装产品设计相关经验尤佳。 薪资仅供参考，具体以面议为主。
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