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2027届-资深工艺研发工程师-玻璃基封装

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2027届-资深工艺研发工程师-玻璃基封装

中微网络公司

2027届-资深工艺研发工程师-玻璃基封装

19 days ago

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Important information


Contract type:

Permanent

Salary:

CN¥240,000 – CN¥276,000 / year

Location:

Shanghai, China

Work mode:

Onsite

Published on:

9 October 2026

What they need


该职位来源于猎聘 职位描述: 中微公司大平板设备事业部深耕新型显示核心装备研发与制造领域,以打破国外技术垄断、推动国产高端PECVD、Dry etch、 ALD 、PVD等装备自主创新为核 心使命。我们以新型平板显示装备的技术突破与产业化为出发点,并积极推动半导体先进封装装备研发,核心团队拥有多年新型显示装备开发与量产经验,已形成覆盖技术研发、工艺验证到规模化应用的全链条能力。其中,

工艺工程师团队作为技术核心力量

,融合物理化学、材料科学、机械设计、射频技术及仿真技术等多学科知识,贯穿设备从原型验证到产线规模化应用的全生命周期,承担着解决工艺稳定性、均匀性及器件性能匹配等“卡脖子”问题的关键职责。团队通过跨领域技术整合与创新,持续推动设备硬件与显示器件性能的深度融合,是推动国产高端显示装备技术持续突破和发展的优秀平台。 主要职责: 1.针对团队研发设备,设计实验进行表征验证,完成工艺开发优化工作,输出工艺配方; 2.对关键的工艺参数进行模拟和实验,建立工艺特性结果数据库; 3.现场协助客户工艺调试,实现设备快速量产和产品良率提升; 4.与机械团队密切合作,进行产品设计和性能提升; 5.提供创新的工艺方案以解决关键工艺问题; 6.编写培训文档和手册,并在现场或课堂环境中开展培训; 7. 生成知识产权并撰写有关工艺、设备的技术论文。

  • Design experiments for characterization and validation of team-developed equipment, complete process development and optimization, and output process recipes.
  • Conduct simulation and experiments on key process parameters to establish a process characteristic database; leverage simulation and experimental results to enhance the performance of TFT (Thin-Film Transistor) devices.
  • Provide on-site assistance for customer process tuning to enable rapid mass production of equipment and improve product yield.
  • Closely collaborate with mechanical teams to conduct product design and performance enhancement.
  • Develop innovative process solutions to address critical process issues.
  • Compile training documents and manuals, and deliver training in on-site or classroom settings.
  • Generate IP and technical papers related to processes and equipment. 岗位要求: 1.博士学历,应届毕业生。物理、材料化学、物理化学、电子信息等相关专业; 2.具有半导体先进封装研究经验者优先; 3.具备实验设计(DOE)分析及使用JMP、Minitab等软件的能力; 4.优秀的英文读写能力,能阅读专业文献和技术文档; 5.具备创新意识,强烈的学习意愿和能力,能够快速掌握新知识和新技能; 6.具备优秀的沟通能力和团队协作精神。
  • Master’s degree or above,

Majors in Physics, Materials Chemistry, Physical Chemistry, Electronic Information or other related fields.

  • Prior experience in advanced semiconductor packaging is preferred.
  • Proficient in Design of Experiments (DOE) analysis and software tools such as JMP and Minitab.
  • Excellent English reading and writing skills, with the ability to comprehend professional literature and technical documents.
  • Innovative mindset, strong learning motivation and adaptability, with the capability to quickly master new knowledge and skills.
  • Outstanding communication skills and a collaborative team player.

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