芯联集成电路(上海)有限公司
封装研发工程师（2027届）(J10887)
2 months ago
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Important information
Contract type:
Permanent
Location:
Shaoxing, Zhejiang, China
Work mode:
Onsite
Published on:
17 August 2026
What they need
该职位来源于猎聘 职责描述： 1. 与产品工程师协同，为客户提供封装解决方案； 2. 与材料供应商、生产工艺工程师一起确认工艺方案，保证工艺路线能够顺利量产，并保证满足客户可靠性要求； 3. 负责良率的改善与提升； 4. 调研业界的最新动态，不断改进封装技术和设计。 任职要求： 1. 学历：硕士学历 2. 专业：微电子、通信工程、半导体封装、电子、材料、机械结构、自动化等相关专业有IGBT/SIC项目或实习经验者优先 3. 较强的沟通协调能力，团队合作精神 4.有良好的逻辑思维能力，善于分析问题与解决问题
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