芯联集成电路(上海)有限公司
封装设备工程师（2027届）(J10939)
2 months ago
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Important information
Contract type:
Permanent
Location:
Shaoxing, Zhejiang, China
Work mode:
Onsite
Published on:
13 August 2026
What they need
该职位来源于猎聘 职责描述： 1.负责生产设备安装调试与预防保养 2.负责生产设备保障排查与技术改进 3.负责提升设备的运行效能与稳定性 4.负责确保设备高效运转 任职要求： 1.应届本科及以上学历，通信工程类，机械类，自动化类，电气类，测控仪式等理工类相关专业 2.对半导体/封装/封测设备等岗位工作充满兴趣并热衷于在相关领域实现个人职业发展长久规划； 3.具有较强的团队精神、沟通能力、学习能力及问题分析处理能力； 4.熟悉封装制造，有封装实习经验者优先； 5.良好的英语听说读写能力。
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