深圳市多一维教育文化有限公司
封装设计工程师-2027届(J11187)
2 months ago
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Important information
Contract type:
Permanent
Location:
Shanghai, China
Work mode:
Onsite
Published on:
16 August 2026
What they need
该职位来源于猎聘 岗位职责： 1.负责新产品的封装设计，从质量、性能和成本维度出发，提供有竞争力的封装方案 2.负责封装设计规则及相关数据库的维护 3.负责新封装技术的调研和分析工作 4.负责热、应力仿真的分析工作 任职资格： 1.2027届应届生，硕士及以上学历，电子封装、材料、力学类相关专业 2.具备较强的执行力,逻辑严谨清晰,责任心强 3.符合艾为价值观:简单、皮实、智慧、靠谱
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