捷普科技(上海)有限公司
2.5D硅桥研发工程师
2 months ago
Share this opportunity
Share this opportunity to other talents of your network:
✓ Offer them a visibility boost with clients.
✓ Help your contacts find their next job.
Important information
Contract type:
Permanent
Location:
Beijing, China
Work mode:
Onsite
Published on:
16 August 2026
What they need
该职位来源于猎聘 一、岗位说明：
2.5D硅桥工艺研发，负责设计实验(DOE)，操作手动机台及实验室设备进行打样，取得实验数据，分析实验结果及原理,制定工艺路线及工艺窗口。 二、任职要求： 1.具有2.5D及相关研发经验，具有半导体封装工艺设备及材料的知识,能力及经验，特别是 TCB相关经验，临时键合/解键合及各种键合材料相关经验。 2.具有团队合作能力及团队管理能力。 三、录用优先条件：TCB/临时键合/解键合及各种键合材料相关经验，项目管理
Other offers great for you!
These companies are also looking for great profiles
Visian
Confirmed E-Invoicing RUN Administrator
Freelance
Paris, France
Onsite, Hybrid
Skills
16 hours ago
Quick apply
Ecocea
Expert Sécurité Varonis
Freelance
Paris, France
Onsite
Skills
10 hours ago
Quick apply
Teamco
Responsable d'Agence - ESN Engineering
Permanent contract
Aix-en-Provence, France
Onsite
Skills
10 hours ago
Quick apply
No company information available.