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27校招-硬件工程师(北京) (MJ002151)

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27校招-硬件工程师(北京) (MJ002151)

北京东土科技股份有限公司

27校招-硬件工程师(北京) (MJ002151)

4 months ago

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Important information


Contract type:

Permanent

Location:

Beijing, China

Work mode:

Onsite

Published on:

7 August 2026

What they need


该职位来源于猎聘 岗位职责: 负责硬件电路原理图的设计、仿真及调试。 开发、优化PCB布局布线,确保电路性能与可靠性。 实施硬件样机的焊接、组装及功能测试验证工作。 维护和改进现有硬件产品平台,提升产品性能和质量。 配合软件开发工程师,完成硬件与软件的协同调试。 基于工业通信标准,开发相关通信设备硬件。 分析、诊断并解决产品测试及生产过程中出现的硬件问题。 职位要求: 电子工程、通信工程、自动化等相关专业,本科及以上学历; 掌握模拟电路、数字电路理论基础; 了解常用电子元器件特性及硬件开发流程; 具备电路图设计工具使用能力和一定的编程基础; 良好的学习能力、沟通协调能力与问题解决能力; 积极主动,具备良好团队合作精神; 大学英语四级及以上;具备一定的专业英语读写能力。

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