日月新半导体有限公司
先进封装研发副理(bumping)(J10446)
2 months ago
Share this opportunity
Share this opportunity to other talents of your network:
✓ Offer them a visibility boost with clients.
✓ Help your contacts find their next job.
Important information
Contract type:
Permanent
Location:
Suzhou, Jiangsu, China
Work mode:
Onsite
Published on:
12 August 2026
What they need
该职位来源于猎聘 职责描述： 1.对先进封,如Fan out/InFO/CoWoS/CoPoS/Glass core/TGV制程整合规划
- 熟悉BD/POD design
- Assembly PID setup and check
- 研发专案的开展及追踪
- 研发完成导入量产
- 完成主管交代事项
任职要求： 1、5年以上熟悉CoWoS/CPO/Fan out/Bumping全流程， 并主导完成相关专案（具备其一即可） 2、5年以上photo/sputter 制程经验（具备其一即可） 3、具备基本英文沟通能力，能直接与国外客户进行技术交流
Other offers great for you!
These companies are also looking for great profiles
Bloomco
Medtech - Technicien dessinateur-projeteur R&D mécanique
Freelance
Paris, France
Onsite
Skills
1 day ago
Quick apply
Espace Freelance
DEVELOPPEUR PLATEFORME IA / AGENTS
Freelance
Dunkirk, France
Onsite, Hybrid
Skills
1 day ago
Quick apply
Espace Freelance
Audit Applicatif support & Intelligence artificielle
Freelance
Lille, France
Onsite, Hybrid
Skills
1 day ago
Quick apply
No company information available.