Winbond
(高雄)化學機械研磨(CMP)模組開發工程師
1 month ago
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Important information
Contract type:
Permanent
Location:
Kaohsiung, Gushan District, Kaohsiung City, Taiwan
Work mode:
Onsite
Published on:
8 September 2026
What they need
【工作內容】 作為華邦的(高雄)化學機械研磨(CMP)模組開發工程師，你將於產品製程研發階段，接觸公司最先進的製程技術，工作內容包含：
- 記憶體 / 3D-IC CMP製程開發
- 製程調整與數據分析
- 良率提升
【條件要求】 學歷要求：碩士
科系要求：材料工程相關 │ 化學工程相關 │
相關經驗：3年以上
語言能力：英文 中級 │ │
管理責任：No
輪班需求：No
出差需求：1個月以下
外派需求：No
其他條件：
- 具備CMP製程開發經驗尤佳
- 具備Wafer bonding, Si Trimming & Grinding 製程經驗尤佳
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