Winbond
(高雄)客製化記憶體製程整合工程師
6 months ago
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Important information
Contract type:
Permanent
Location:
Kaohsiung, Gushan District, Kaohsiung City, Taiwan
Work mode:
Onsite
Published on:
7 August 2026
What they need
【工作內容】 作為華邦的(高雄)客製化記憶體製程整合工程師，
- 電容及記憶體技術開發 2.客製化記憶體製程整合與技術開發，良率及品質之提昇並導入量產 3.面對客戶協調客製化記憶體開發 4.相關製程、模組、與產品之可靠性分析、驗證及改善 5.開發低碳綠色半導體製程技術
【條件要求】 學歷要求：碩士
科系要求：工程學科類(全部) │ 物理學相關 │ 材料工程相關
相關經驗：3年以上
語言能力： │ │
管理責任：No
輪班需求：No
出差需求：無
外派需求：No
其他條件：
- 具備製程整合經驗尤佳 2. 具備WAT測試分析能力與了解半導體元件物理尤佳 3. 具備記憶體或邏輯製程經驗亦可 4. 具備與客戶溝通與談判能力，能深入洞察客戶需求，並提供具建設性的解決方案
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