上海东铸智能科技有限公司
固件工程师
Skills
il y a 3 mois
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Important information
Contract type:
Permanent
Work mode:
Onsite
Published on:
7 août 2026
What they need
该职位来源于猎聘 岗位可放苏州/上海 职位描述 设计并实现芯片 BootROM、BootLoader、Firmware HAL(含 clk/reset/power/PCIe/DDR/UCIe 等); 在 FPGA/Emulator 平台完成固件 bring-up 及驱动联调,支撑验证团队定位软硬件 bug; 负责 EVT/DVT/PVT 阶段固件测试、性能调优与量产程序发布; 与硬件、驱动、算法、验证团队协同,定义软硬件接口(API/寄存器/消息队列),推进芯片级性能优化; 建立固件 CI/CD 流程(GitLab + Python 脚本 + Robot Framework),实现每日自动构建与回归; 编写可交付技术文档:Firmware Spec、Bring-up Report、Test Plan、User Guide 等。 职位要求 计算机/电子/自动化等相关专业,本科及以上学历,3 年以上芯片固件开发经验; 精通 C 语言,熟悉 Python/Shell 脚本,具备良好的硬件调试能力; 熟悉 ARM/RISC-V 架构,掌握 SPI/I²C/UART/PCIe/USB 等常见接口协议; 有实际 BootLoader 或底层驱动开发经验,能看懂芯片 Register TRM 与原理图; 熟悉 Git、Jenkins、Gerrit 等版本管理与代码审核工具。
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